| 摘要 |
PURPOSE:To contrive a reduction in the temperature rise of an LDA by a method wherein the peripheries of a semiconductor laser array (LDA) chip on a heat sink are fixed with an insulating heat conductive material. CONSTITUTION:With an LDA chip 1 provided with two pieces of light-emitting points 2 and 2a and electrodes 3 and 3a on the points bonded on a mount (heat sink) 5 facing upward the electrodes 3 and 3a, the peripheries of the LDA chip are fixed with an insulating heat conductive agent (an epoxy bonding agent filled with an inorganic matter) 6 including lead wires 4 and 4a of the electrodes 3 and 3a as well. As the outer peripheries of the chip 1 other than a luminescent surface are molded with the thermal conduction agent 6, the heat to be generated at the points 2 and 2a passes through the heat conductive agent 6 on the peripheries of the chip 1 and flows to the mount 5. Thereby, the effect of heat dissipation of an LDA is increased.
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