| 摘要 |
PURPOSE:To improve the mounting density and the electric characteristic by forming a minute termination resistor matching a wire impedance in a mounting board between a power supply pattern having a prescribed potential in an IC and a bonding pad and connecting one terminal to the bonding pad and the other terminal to the power pattern. CONSTITUTION:A GaAs IC chip 3 is mounted on an insulation board 11 via a die bonding pad 2. A resistor 6 to be a termination resistor is formed on the GaAs IC chip 3, one electrode is connected to a power terminal 8 on the chip and the other electrode is connected to a power pattern 7 having a pre scribed potential. The resistor 6 is formed only to a signal input terminal 81' acting like to eliminate multiple reflection due to impedance mismatching to prevent the reflection of the signal propagated on the wire of the mounting board. Since no termination resistance is formed on the mounting board, the mounting efficiency is improved considerably and the resistor is formed at the nearest position to the chip electrode, the electric characteristic is improved. |
