| 摘要 |
PURPOSE:To make it possible to surely secure and hold a thin plate material with a high degree of accuracy by providing a resilient thin film having vacuum holes communicated with vacuum holes in a vacuum chuck body, on the attracting surface side of the vacuum chuck body for sucking a semiconductor wafer. CONSTITUTION:A vacuum chuck 1 comprises, a vacuum chuck body 2 made of, for example, metal, a plurality of holes 3 formed vertically piercing through the vacuum chuck body, for vacuum attraction and a vacuum sucking path forming section 4 which merges the vacuum holes 3 and communicated with a vacuum source 5 through a vacuum chuck rotating motor M. The method of manufacturing the vacuum chuck 1 comprises the steps of filling a meltable material into the vacuum holes 3 in the vacuum chuck body 2 so as to plug the holes 3, and coating a resilient material on the vacuum chuck body. Thereafter, the vacuum chuck body 2 is heated to melt and remove the meltable material, the holes 3 communicated with the vacuum holes 3 in the vacuum chuck body 2 are formed in a resilient membrane 6. |
