发明名称 MOLD DEVICE FOR INTEGRALLY MOLDING SURFACE FILM
摘要 PURPOSE:To contrive to improve the yield of a product while reducing the man-hour and necessary time for operation by a method in which a surface film layer is molded by the plasma polymerization reaction generated in a cavity, and then said cavity is filled with molding resin. CONSTITUTION:After the inside of a mold has been vacuum-sucked through a vacuum-sucking device 2, voltage is applied to discharging electrodes 4 in a plasma polymerization device 3, and the monomer in a monomer source 6 and the gas in a inert gas vessel 16 are guided through stop valves 5a, 5, whereby plasma is made there, and then it is sent into a cavity 10. Since the inside of the cavity 10 is grounded, a surface film layer 17 is molded on the inner surface of the cavity 10. Next, the inside of the surface film layer 17 in the cavity 10 is filled with molding resin 18 from the nozzle 14 of a molding machine, and the operation is finished. Consequently, the cleaning and drying process and the handling therefor of the molded object which have been hitherto necessary for molding the surface film layer 17, becomes unnecessary. The reduction of operational processes and the shortening of necessary time in producing the molded object may be achieved, and its yield is improved.
申请公布号 JPS63256426(A) 申请公布日期 1988.10.24
申请号 JP19870090828 申请日期 1987.04.15
申请人 HITACHI LTD 发明人 TAKESHITA MASAMICHI;INAGE HISAO;TAKAGI MASAO;SAKUMA TOSHIJI;MURANAKA MASAYUKI
分类号 B29D11/00;B29C43/18;B29C45/14;B29C49/20;B29C59/14;B29L11/00 主分类号 B29D11/00
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