| 摘要 |
PURPOSE:To make it possible to seal a photodetector and a semiconductor element with one kind of light transmitting filter resin, by a method wherein a photodetector only is subjected to a face-up bonding of the light receiving surface to the substrate surface of a device, the other semiconductor elements are subjected to a face-down bonding, and all of them are sealed with a light transmission filter resin. CONSTITUTION:A photodetector 3 is subjected to a face-up diebonding of the light receiving surface to a circuit wiring conductor 2, and the light-receiving surface side is bonded to a bonding wire 5. A semiconductor element 4 to process a signal of the photodetector 3 is subjected to a face-down bonding of its functional element forming surface to finger leads 9, in order to avoid the influence of an incident light to the photodetector. The whole body of the photodetector 3 and the semiconductor element 4 is sealed with a light transmission filter resin 6 which transmits only the light having a wavelength in the operation band of the photodetector 3, and cuts off all of the light having a wavelength in the other band. Thereby, the device can be sealed with one kind of light transmission filter resin, and the working efficiency can be improved.
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