发明名称 HIGH ACCURACY POLISHING METHOD FOR COMPOSITE MATERIAL
摘要 <p>PURPOSE:To provide high accuracy in finished configuration by heating the surface of a workpiece while gradually cooling and bonding the workpiece and thereafter polishing when the workpiece consisting of a plurality of materials having different coefficients linear expansion is bonded to an attached surface plate through thermoplastic adhesives. CONSTITUTION:Thermoplastic adhesives 3 like electrowax are thinly uniformly applied on an attached surface plate 2 and a workpiece 1 formed of a plurality of materials having different coefficients of linear expansion is mounted on said adhesives pressed and stretched by hands to provide uniform adhesion. Then, the surface of workpiece 1 is heated by an infrared ray heater 4 while being gradually cooled and bonded. Then, the warping of workpiece 1 caused by a difference between room temperature and bonding temperature is corrected by the infrared ray so that the workpiece 1 is bonded to the attached surface plate 2 while keeping the configuration under the room temperature. Thus, high accuracy adhesion can be provided and high accuracy configuration can be polished.</p>
申请公布号 JPS63256354(A) 申请公布日期 1988.10.24
申请号 JP19870092720 申请日期 1987.04.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMASHITA MIKIO;HARA SEIICHI;MATSUNAGA HIROYUKI
分类号 B23Q3/08;B24B37/04;B24B37/30 主分类号 B23Q3/08
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