发明名称 MANUFACTURE OF COOLING DEVICE FOR ELECTRONIC ELEMENT BODY
摘要 PURPOSE:To improve a cooling characteristic, by expanding a heat pipe, and closely attaching the material of the heat pipe with a metal block as a unitary body. CONSTITUTION:A hole 3 is formed in a metal block 2. One side 9a of a heat pipe material 9, whose diameter is smaller than the diameter of the hole 3, is inserted into the hole 3. A plurality of cooling fins 10 are provided on another side 9b of the heat pipe material 9. The fin 10 has a hole 10a, whose diameter is larger than the diameter of the heat pipe material 9 and is the same as or smaller than the diameter of the hole 3 of the metal block 2. Then the heat pipe material 9 is expanded. A pipe expanding tool 11 is inserted into the end part of the other side 9b of the heat pipe material 9b. The tool 11 is made to advance so as to expand the heat pipe material 9a toward the side 9a with compressing force. When the other side 9b of the heat pipe material 9 is expanded, the cooling fins 10 are also expanded. The coupling force between the other side 9b of the heat pipe material 9 and the cooling fins 10 becomes high, and adhesion between both parts becomes remarkably excellent, while the thermal resistance between both parts is remarkably decreased.
申请公布号 JPS63254755(A) 申请公布日期 1988.10.21
申请号 JP19870089092 申请日期 1987.04.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAKAGE HISAAKI;KATAOKA KENJI
分类号 H05K7/20;H01L23/427;H01L23/46 主分类号 H05K7/20
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