发明名称 FILM THICKNESS CORRECTING DEVICE FOR FILM FORMING DEVICE
摘要 PURPOSE:To uniformize the thickness of the vapor deposited film on a substrate surface with a film forming device having plural evaporation sources by detaching the plural evaporation sources from the revolving shaft of a substrate holder and providing partition plates between the respective evaporation sources. CONSTITUTION:This film forming device is provided with the plural evaporation sources 4 and the rotatable substrate holder 1 mounted with the substrate 2 opposite to said sources. A spacing L is provided between the center of each evaporation source 4 of such film forming device and the revolving shaft of the holder 1 and the partition plates 3 partitioning the spacings between the respective evaporation sources 4 are so installed as to be perpendicular to the substrate 2. The above-mentioned spacing L is previously set relatively narrow so that the film thickness decreased toward the peripheral part of the substrate 2 and increases toward the center thereof in the state in which the partition plates 3 do not exist. The incident angle of the evaporated material is more limited in the central part than in the peripheral part of the rotating substrate 2 and the degree of a decrease in the film thickness of the central part increases as the length of the partition plates 3 increases. The film thickness in the diametral direction of the substrate 2 is uniformized by optimizing the height H of the partition plates 3.
申请公布号 JPS63255368(A) 申请公布日期 1988.10.21
申请号 JP19870088813 申请日期 1987.04.13
申请人 HITACHI LTD 发明人 OGAWA YOSHIFUMI;YUKIMASA TORU;KANAI SABURO
分类号 C23C14/54 主分类号 C23C14/54
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