LIQUID IMMERSION COOLING ASSEMBLY FOR INTEGRATED CIRCUITS

摘要

Integrated circuit packaging assembly (10) in which a plurality of electrical pins (46) of an integrated circuit package (40, 42) is removably mounted to a corresponding plurality of mating pins (50) each having a receptacle (52) filled with liquid mercury (60), and the temperature is reduced such that the liquid mercury (60) solidifies thereby firmly bonding the electrical pins (46 and 50) together. The mating pins (50) are mounted inside a Dewar type vessel (12) and the assembly is covered with a low temperature liquified gas (20) for the dual purpose of solidifying the liquid mercury (60) and cooling the integrated circuit package (40, 42).