| 摘要 |
PURPOSE:To decrease the number of components and mandays on assembly by changing a thermoelectric conversion blank consisting of n-type and p-type semiconductors into a multilayer, cutting the blank in specified sizes and connecting the multilayer thermoelectric transducers in series through metallic connecting pieces between a pair of insulating plates. CONSTITUTION:N-type and p-type same shape thermoelectric transducers 1a, 1a and 1b, 1b are joined through metallic junction layers 9, thus shaping an easily treated multilayer thermoelectric conversion material 10. The multilayer thermoelectric conversion material 10 is cut by using a wire saw, etc., so as to be made perpendicular to the upper and lower parallel planes of the material 10, thus acquiring separate multilayer thermoelectric transducer 11. Insulating plates 4, 5 are arranged so as to hold the upper and lower parallel planes of the multilayer thermoelectric transducers 11. The insulating plates 4, 5 are shaped from alumina substrates, the insides of which have metallic connecting pieces 6, 7 consisting of a mutually isolated good conductive metal such as Cu or Ni or the like. Such a multilayer thermoelectric conversion device is used as a cooling device, for example. Temperature difference between both insulating plates is increased, improving cooling power.
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