| 摘要 |
PURPOSE:To make a metallic fine wire to be connected exhibit the property of perpendicularity and keep the intensity of connection using pressure constant by mounting a metallic fine wire fixing plate at the upper and lower parts of a capillary when the metallic fine line is connected to a semiconductor element and an electrode. CONSTITUTION:After a semiconductor element 1 and an electrode terminal 2 on a semiconductor device are connected by bonding each other with a metallic fine wire 3, this device permits only a capillary 6 having a through hole 4 to move upward and the first metallic fine wire fixing plate 5 is opened. The second metallic fine wire fixing plate 7 where the fine wire 3 is inserted, and is fixed is equipped at a lower side of the capillary and then, the fine wire 3 is fixed by causing it to be perpendicular as it is. The fine wire 3 is fused by a hydrogen flame of a hydrogen torch burner 8. Once the fixing plate 7 comes up, the fine wire 3 connecting on the terminal 2 is cut and then, it is left as an unnecessary metallic fine wire 9. The fine wire 9 is sucked up by an attracting device 11 which moves up to a lower part of the fixing plate 7 at the same time the capillary 6 returns to its original position. |
