| 摘要 |
PURPOSE:To obtain a semiconductor IC device where there are much pads but their chip sizes are compact and its assembly property is highly efficient by arranging the pads at optimum positions in consideration of an arrangement combination of linear and zigzag form pads as well as factors which influence merits and demerits of the assembly property. CONSTITUTION:Pads 1 are connected to leads 7 through wires 6 and are arranged in the form of linear arrangement at a corner part of a chip and in the form of zigzag arrangement in the vicinity of the center of a chip side 3. The centers of the pads 1b and 1d are positioned on the circumference of circles such that their centers N2 and N1 are those of the pads 1c and 1e and their radius is L. Then, a distance between wires becomes large, that is l2 and a wiring angle theta also becomes large. Thus, a semiconductor IC device where there are much pads but their chip sizes are compact and its assembly property is highly efficient is obtained. |
