| 摘要 |
PURPOSE:To achieve accurate evaluation of adhesiveness of a plated layer, by conducting a punching test, a heat impact test, a compression test and a peeling test sequentially for the plated layer. CONSTITUTION:A punching 4 is performed at several points of a plated surface 2a of a sample 2 to evaluate a relatively light peeling property of a compound plated layer due to an initial cracking 5 then caused. Then, after heated with a heating furnace, the plated surface 2a is immersed into water to cool thereby performing a heat impact test. A medium degree of peeling property of the plated layer is evaluated from a crack 6 grown from said initial crack 5. Then, the sample 2 undergoes a compression test with a compression tester 7. Then, the plated surface 2a is deformed and the peeling of the current crack 6 is detected to evaluate a peeling property in strength from the peeling. Finally, a tape 8 is stuck on the plated surface 2a and a tape peeling test is performed. Thus, a final evaluation of adhesiveness is accomplished from a peeling area of the plated layer obtained at this time.
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