| 摘要 |
A plurality of layers of a multi-layered, thick film circuit are simultaneously fired in an infrared furnace after being separately applied to the underlying substrate and separately dried. Specifically, a first layer of a hardenable conductive paste containing conductive particles in a volatile organic binder is applied to a substrate. Then, the first layer is dried at low temperature to remove most of the volatiles, without fusing the particles. Next, a second layer of a hardenable dielectric paste containing dielectric particles in a volatile organic binder is applied to the first layer. Then, the second layer is dried at low temperature to remove most of the volatiles, without fusing the particles. This process is repeated until a desired number of layers has been formed on the thick film circuit. The final step is to fire all the layers simultaneously in an infrared furnace at high temperature to fuse the particles of each layer. |
