| 摘要 |
PURPOSE:To obtain a multilayer ceramic substrate structure, cost of which is reduced and which has an excellent cooling effect, by forming a hole path connected to an external surface into a substrate laminate. CONSTITUTION:Pattern wirings 4 for shaping circuits in each layer and one of through-holes 3 connected to the wirings 4 and for connection to an external circuit or pattern wirings in other layers are formed to a substrate laminate 12. Holes paths 9 for cooling having opening sections in external-surface side faces are shaped reticulately to the laminate 12 in order to remove heat generated from a circuit element set up on the inside and an LSI chip, etc., fitted onto an external surface at that time. Accordingly, a multilayer ceramic substrate structure, cost of which is reduced and which has an excellent cooling effect, is acquired. |
