| 摘要 |
PURPOSE:To be hardly influenced electrically and to prevent the damage at a corner part of a package by a method wherein a shape of an external circumference part of the package is formed to be a polygon with more than five corners or a circle and the length of a wiring pattern up to an external circumference face of the package is made nearly equal. CONSTITUTION:A semiconductor package includes a semiconductor device 1, a wiring pattern 2 and external lead terminals 4 which are formed by extracting the wiring pattern 2 to an external circumference part 3 of the package. The external circumference part 3 is formed to be a regular octagon by using an insulating material; the whole shape of the package is formed to be a thin regular octagon. By this setup, each lead wire of the wiring pattern 2 is situated on a circumferential face at the circumference part 3 of the package at equal intervals; the length of each lead wire is made nearly equal. Accordingly, when the semiconductor device 1 is used, the electrical characteristics such as a speed of an information signal from the semiconductor device 1 to the external lead terminals 4 or the like can be kept constant. As a result, an electrical influence by the wiring pattern 2 due to a difference in the length of leads is eliminated; a corner part of the package is not damaged.
|
