发明名称 |
METHOD OF SEALING ELECTRONICS COMPONENT |
摘要 |
Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25 x 10<-><4> cal/cm-sec- DEG C) and improved stress characteristics (e.g., a thermal shock cycle number of at least 30). |
申请公布号 |
JPS63250160(A) |
申请公布日期 |
1988.10.18 |
申请号 |
JP19880065584 |
申请日期 |
1988.03.18 |
申请人 |
DEXTER CORP:THE |
发明人 |
FUIRITSUPU JIEI PUROKUTAA |
分类号 |
C08K3/14;H01B3/40;H01L23/29;H01L23/31 |
主分类号 |
C08K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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