| 摘要 |
PURPOSE:To reduce characteristic variation due to heat stress and to improve the reliability of a semiconductor pressure sensor by connecting and fixing the output terminal of a semiconductor pressure sensor chip which transduces pressure into an electric signal to a conductor wired on a flexible board. CONSTITUTION:This sensor consists of the flexible board 1 formed of flexible resin where the conductor 6 is wired and the pressure sensor chip 2, whose output terminal is soldered 11 to the conductor 6 to make an electric connection and also support it mechanically. Then external force applied to a flexible protection film 3 is transmitted to a pressure receiving diaphragm 10 to generate stress proportional to the pressure difference from a reference pressure chamber 8 in a diaphragm 10; and the stress is transduced into the electric signal by a strain gauge on the diaphragm 10 and the output of the chip 2 is led out through the conductor 6. Consequently, the sensor 10 which has high reliability can be obtained.
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