发明名称 Surface mounted decoupling capacitor
摘要 A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between the top of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. Two leads of the DIP package are inserted into the pair of insertable contacts in the auxiliary insulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board.
申请公布号 US4779164(A) 申请公布日期 1988.10.18
申请号 US19860941454 申请日期 1986.12.12
申请人 MENZIES, JR., L. WILLIAM;MENZIES, STEPHEN W. 发明人 MENZIES, JR., L. WILLIAM;MENZIES, STEPHEN W.
分类号 H01G4/35;H01L23/64;H05K1/02;H05K1/14;H05K1/18;H05K7/10;(IPC1-7):H05K7/10 主分类号 H01G4/35
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