发明名称 MOLDING METHOD AND APPARATUS FOR PRINTED-CIRCUIT BOARD
摘要 PURPOSE:To make a sealing operation of a vacuum bag by an operator unnecessary, by flowing a high pressure heated fluid in a soft rubber bag, heating and pressing thereby a material to be molded over the whole surface and thereby adhering and hardening it. CONSTITUTION:A porous plate 50 provided with a vacuum channel is placed on a machine platen 4 and then, a mirrorlike plate 51, a releasing film, a copper foil 53, a prepreg 54, an inner layer circuit-board 55, a prepreg 54, a copper foil 53, a releasing film 52, a mirrorlike plate 51, a releasing film, a copper foil 54, a prepreg 54, an inner layer circuit-board 55, a prepreg 54, a copper foil 53, a releasing film 52 and a mirrorlike plate 51 are successively laminated. Then, these material to be molded 1 is covered with a breathing cloth 56. Then, a high pressure steam is fed in the machine platen 4 and a high pressure heating gas is fed in a soft rubber bag 3 by a fluid supplying means. Then soft rubber bag 3 is expanded by the pressure and the material to be molded 1 is heated over the whole surface and thereby adhered and hardened.
申请公布号 JPS63251207(A) 申请公布日期 1988.10.18
申请号 JP19870085251 申请日期 1987.04.07
申请人 ASHIDA SEISAKUSHO:KK 发明人 NAKAJI MASASHI
分类号 B29C43/10;B29C43/20;B29C43/56;B29K105/06;B29L9/00;B29L31/34;H05K3/46 主分类号 B29C43/10
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