| 摘要 |
PURPOSE:To obtain a Cu alloy material having excellent resistance to thermal flaking of tin or tin alloy layer by specifying the compsn. consisting of Sn, Fe, P, Zn and Cu. CONSTITUTION:The titled material contains, by weight, 0.8-2.5% Sn, 0.05-0.15% Fe and 0.02-0.05% P, furthermore contains 0.1-0.5% Zn and the balance consisting substantially of Cu. The material is used as the material for electronic parts such as a terminal, connector and lead frame, by which the reliability of the incorporated electronic equipment can be increased.
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