| 摘要 |
PURPOSE:To prevent wrinkles by a method wherein tension is applied to a protective tape uniformly and radially from the center of the wafer. CONSTITUTION:A wafer protective tape 1 is sucked up upon contact with an O-ring 5, and the interval cavity is evacuated. The wafer protective tape 1, owing to the difference in pressure, is sucked in the arrow-indicated direction, and is subjected to tension radiating uniformly from the center of a wafer 2 outward. A chuck table 3 mounted with the wafer 2 is then caused to go up for the attachment of the water protective tape 1 to the wafer 2. The wafer protective tape 1 subjected to a uniform tension may be uniformly bonded to the wafer 2. |
