| 摘要 |
<p>PURPOSE:To enhance the dampproofness by a method wherein a thickness of a bonding pad part is made thick by laminating multilayer aluminum sheets in order to prevent a defect from being caused by a probe of a semiconductor inspection system and the moisture from penetrating. CONSTITUTION:A thickness of a bonding pad part for a semiconductor device using multilayer aluminum sheets is made thick by laminating the multilayer aluminum sheets. For example, the bonding pad part is formed by laminating a one-layer aluminum sheet 1 and a two-layer aluminum sheet 3; its peripheral part is covered with a first insulating film 5 and a second insulating film 6. By this setup, when an electrical test or the like of the semiconductor device is executed on a wafer, a probe of a semiconductor inspection system is hard to reach the lower part of the aluminum sheets; accordingly, it is possible to prevent the moisture or the like from penetrating and to enhance the dampproofness.</p> |
