| 发明名称 |
LOGIC-CIRCUIT LAYOUT FOR LARGE-SCALE INTEGRATED CIRCUITS |
| 摘要 |
<p>LOGIC-CIRCUIT LAYOUT FOR LARGE-SCALE INTEGRATED CIRCUITS A VLSI chip has multiple annular rings of circuit cells, interspersed with annular wiring channels for interconnecting the cells. Another wiring layer runs perpendicular to the rings. A central chip area contains all the I/O connections for the chip.</p> |
| 申请公布号 |
CA1243423(A) |
申请公布日期 |
1988.10.18 |
| 申请号 |
CA19860508411 |
申请日期 |
1986.05.05 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DUNHAM, BRADFORD;FITZGERALD, JOSEPH M.;WILLIAMS, ROBERT R. |
| 分类号 |
H01L21/822;H01L21/3205;H01L21/82;H01L23/52;H01L23/528;H01L27/02;H01L27/04;H01L27/118;(IPC1-7):H01L27/00 |
主分类号 |
H01L21/822 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
