| 摘要 |
PURPOSE:To set arbitrarily a loading rate to facilitate the inhibition of impact force by a method wherein the title device is provided with a spring mechanism (can be an air pressure system) over a bonding tool and a bonding load is applied through this mechanism. CONSTITUTION:A spring mechanism 12 is provided over a bonding tool 13 and moreover, a load to be applied to the upper part of the mechanism 12 is detected. That is, the tool 13 heated by a heater 14 and a guide 18 are descended by a driving force 19 and when the tool 13 comes into contact with a tape carrier 15, the tool's own weight is applied and thereafter, a load is gradually increased with the compression of the spring 12 and if a load measuring instrument 11 reaches a constant value, the tool and the guide are stopped or are made to ascend and the setting of a load is performed. Thereby, an abrupt thermal impulse (temperature rise) is not associated with because contact force is gradually increased even in a thermal manner, not to mention impact due to a load, and damage to semiconductor elements and their destruction can be reduced.
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