发明名称 SEMICONDUCTOR LEAD FRAME
摘要 PURPOSE:To prevent exfoliations due to long time heating after coating with tin or solder, by constituting at least a three-layered structure in which a nickel- plated layer is interposed between a copper alloy and a copper-plated layer. CONSTITUTION:A copper alloy is plated with nickel and copper after a prescribed cleaning treatment such as alkali degreasing, electrolytic-degreasing, pickling and rinsing. Usual electroplating is applied to said nickel plating and copper plating, and another dry plating such as electroless plating and vacuum metallizing is applicable. By providing at least a three-layered structure in this manner in which a nickel-plated layer is interposed between the copper alloy and a copper-plated layer, the exfoliations of plated layer can be prevented even in the case of employment under a high temperature.
申请公布号 JPS63249361(A) 申请公布日期 1988.10.17
申请号 JP19870082822 申请日期 1987.04.06
申请人 NIPPON MINING CO LTD 发明人 FUKAMACHI KAZUHIKO;MURATA MASATERU
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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