| 摘要 |
PURPOSE:To cut down the cost of manufacture of the title discriminating device by a method wherein the discrimination pattern, which was formed simultaneously with a semiconductor element pattern, is classified automatically. CONSTITUTION:Wafers 21 are sent to the position detecting part 11 of a discrimination pattern 22 from a stoker 15 by a belt 18, the positioning operation of the linear point of intersection of a stripe line 23 in conducted by the detection of a stepping using a laser beam. The position of the pattern 22 is recognized by the relative position from the linear point of intersection, the wafers 21 are sent to a pattern recognition part 12. Then, the pattern 22 is discriminated by the laser beam, the discriminated wafers 21 are classified by a classification part 13 using the method of classification which was inputted into a control part 14 in advance and the wafers are housed in a stoker 16.
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