发明名称 BUILD-UP WELDING METHOD FOR SURFACE OF COPPER MEMBER
摘要 PURPOSE:To form a sound build-up layer having no incomplete penetration nor blow hole, etc., by forming the metal film of low heat conductivity and oxidation resistance on the surface of the member consisting of copper or copper alloy and effecting build-up welding on the film face thereof. CONSTITUTION:Prior to executing a build-up welding, the film of the metal difficult to cause oxidation at high temp. having low heat conductivity, e.g., Ni, cobalt chrome, etc., is formed on the part to form the build-up welding layer of the surface of a member. After the film formation it is subjected to preheating treatment, then, to build-up welding. The build-up layer causing no deformation nor strain on the member and having no incomplete penetration, blow hole, etc., is thus formed.
申请公布号 JPS63248572(A) 申请公布日期 1988.10.14
申请号 JP19870081926 申请日期 1987.04.02
申请人 KUBOTA LTD 发明人 SHINOZAKI TAKESHI
分类号 B23K9/04;B23K9/23 主分类号 B23K9/04
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