| 摘要 |
PURPOSE:To eliminate the complication of package structure, and to remove unnecessary external stress between a chip and a color filter by installing the base members on both sides of the solid-state image sensing chip and mounting the color filter to the base members. CONSTITUTION:A solid-state image sensing chip 4 is fixed onto the bottom edge face 3 of a cavity 2 formed to a ceramic-package 1, and base members 10, 10 in thickness the same as or slightly thinner than the solid-stage image sensing chip 4 are fastened in parallel with the bottom edge face 3. One end of a color filter 6 is fixed at the upper edge sections of the members 10, 10 through ultraviolet curing type adhesives 11, and the light-receiving surface of the chip 4 and the filter 6 are faced oppositely without being bonded with adhesives directly. A material having an expansion coefficient approximately the same as that of the chip 4 is used as the material of the members 10, 10 at that time, and mutual expansion coefficients are added, thus preventing the generation of lateral displacement, etc., due to a temperature change of the chip 4 and the filter 6. According to such constitution, mutual positioning is facilitated, thus improving accuracy.
|
