| 摘要 |
PURPOSE:To prevent concentration to a die pad edge of sealing-resin internal stress due to thermal stress at the time of the packaging of a substrate by forming the shape of a die pad, with which a semiconductor chip is bonded, to a corrugated shape. CONSTITUTION:A semiconductor chip 1 is fixed onto a die pad 2 formed to a corrugated shape with adhesives. Consequently, internal stress in a sealing resin against thermal stress at the time of the packaging of a substrate for a semiconductor device is dispersed by forming the die pad 2 to the corrugated shape, thus shaping structure in which internal stress does not concentrate to the edge of the die pad 2. Accordingly, the cracking of the resin can be prevented. |
