发明名称 SOLID PHASE JOINING DEVICE
摘要 PURPOSE:To obtain larger joining strength without increasing the pressurizing force of a joining face by providing the heat source device giving repeating temp. variation to one part at least of a joining body at the time when the joining face of joining body is brought into contact and causing different thermal expansion and contraction relatively on the joining body. CONSTITUTION:Joining bodies 2A, 2B are fitted to a jig 4B to evacuate a joining chamber 1 in ultrahigh vacuum. The holder 3A holding the joining body 2A by a moving bar 14 is then held and moved to the upper part of a cleaning device 10B to purify the joining faces 201A, 201B of the joining bodies 2A, 2B by cleaning devices 10A, 10B. Thereafter, the holder 3A is returned and the joining face 201A of the joining body 2A is brought into contact with the joining face 201B of the joining body 2B under very small pressure by a pressurizing device 6. The current periodically changing is passed to a heat transfer member 21 from an external part power source 122A. The heat transfer member 121 is then heated, this heat is transferred to the joining bodies 2A, 2B, expansion and contraction are periodically repeated, the small sliding and migration of atoms are caused on the joining faces 201A, 201B and the adherence is promoted to increase the joining strength.
申请公布号 JPS63248582(A) 申请公布日期 1988.10.14
申请号 JP19870081624 申请日期 1987.04.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 KASHIBA YOSHIHIRO
分类号 B23K20/00 主分类号 B23K20/00
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