| 摘要 |
PURPOSE:To cause recessed parts to be filled up with a printing liquid in every nook and corner without any penetration of air into the recessed parts and perform a favorable high-accuracy pattern printing, by filling the recessed parts with the printing liquid by spraying in a reduced pressure chamber. CONSTITUTION:A protective film material 7 is supplied to an intaglio printing plate 3 by spraying in a reduced-pressure chamber 25 in which a pressure of 10<-2>-10<-3> mmHg is maintained, whereby recessed parts 4 are filled with the material 7. Therefore, penetration of air into the recessed parts 4 is prevented, formation of an air layer in the recessed parts 4 is avoided, and the recessed parts 4 are filled up with the protective material 7 in every nook and corner. Accordingly, when the intaglio plate 3 is pressed against a semiconductor wafer 1 to transfer the protective film material 7 in the recessed parts 4 to the wafer 1, a favorable protective film material layer 11 corresponding to the pattern of the recessed parts 4 is formed, and by the subsequent heating treatment, a polyimide layer having a pattern as designed can be formed. Since the printing liquid 7 is so prepared that it can fill up the recessed parts 4 in every nook and corner, a favorable high-accuracy pattern can be printed.
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