发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To perform stable wire bonding, by providing a first solenoid, which links an up-and-down movement block with an arm fixing stage electromagnetically only at the time of high speed descent, a second solenoid, which links the up-and-down movement block with the arm fixing stage electromagnetically, and a bonding plane detector. CONSTITUTION:When a descending speed is switched to an equal speed from a high speed in the vicinity of a bonding plane 11, a high-speed following solenoid 14 is turned OFF. Thereafter, a bonding arm 8, is supported only with a bond setting solenoid 13 and lowers at an equal speed. An up-and-down movement block 3 and an arm fixing stage 4 are supported by a double supporting point 2. Therefore, when a capillary 7 reaches a bonding plane 11, the descent of the arm fixing stage 4 is stopped through the bonding arm 8, but only the up-and-down movement block 3 is slightly lowered. Contactors 14a and 14b are separated. By detecting that the capillary reaches the bonding plane 11 as an electric signal, the up-and-down movement is stopped only for a preset time period, and bonding is carried out.
申请公布号 JPS63246833(A) 申请公布日期 1988.10.13
申请号 JP19870081602 申请日期 1987.04.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 HAYASHI KAZUYUKI;ISHIZUKA MITSUHIRO;OKAMURA MASAMITSU
分类号 H01L21/60 主分类号 H01L21/60
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