Solder-proof (solder-fast) bonding for dental metal connections

摘要

The application describes a method of bonding dental metal parts before they are soldered in a Bunsen flame or in a high-temperature oven by means of a solder-proof bonding agent whose temperature resistance is higher than the soldering temperature or melting point of the solder. The bonding agent is not intended for the defined connection of metals but merely as a fixation agent before and during metallurgical soldering. The solder-proof bonding of the individual dental parts is effected in the mouth or on a jaw model.