| 摘要 |
PURPOSE:To omit the process of bonding in advance a circuit substrate to a backing plate and to reduce the size and thickness of an IC by bonding the substrate to the plate when sealing resin hardens. CONSTITUTION:A backing plate 2 which is formed of a sheet made of metal or resin is contained in the recess 1a of a carrier 1. A circuit pattern 3c is arranged on a circuit substrate 3, a device hole 3b passed to bury an IC is opened, a plurality of positioning holes 3a are formed, and the pin 1b of the carrier 1 is engaged. A thermosetting resin adhesive 5 is dropped to the surface of the plate 2 in the hole 3b, and the IC 4 is carried and bonded. Then, the connecting electrode and the pattern 3c of the IC are connected with a wire 6, is sealed with sealing resin 7, and is hardened. In this case, the resin 7 is filled in a gap 8, reaching the plate 2 on the bottom of the gap 8, and is flowed also to the gap 9 between the substrate 3, and the plate 3, is hardened and is bonded fixedly. |
