| 摘要 |
PURPOSE:To simplify a printed wiring structure and to prevent the occurrence cracks in the inner wall of a through hole in a wiring board, by electrically connecting a plurality of leads, which has no electrically continuation with an inner circuit. CONSTITUTION:When a semiconductor device 1 is mounted on a printed wiring board 10, leads 2 and 3, which have no continuity with an inner circuit, are connected beneath the semiconductor device 1. Under this state, the device 1 is mounted on printed wirings 6 and 7, which are to be connected intrinsically. The leads 2 and 3 and the printed wirings 6 and 7 are connected with solder. Thus the printed wirings 6 and 7 can be mutually connected and are not obstructed with the semiconductor device 1. Since it is not required to put the leads 2 and 3 in a through hole provided in the board 10, cracks do not occur in the board 10.
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