| 摘要 |
PURPOSE:To increase a defect recognition rate, to quicken a processing speed and to simplify a processing program by a method, wherein an image processing is performed about the defect in the surface of a body to serve as an object of evaluation and the length and the aspect ratio of a rectangular image are metered to detect the detect. CONSTITUTION:The direction, in which stacking fault extends, normally becomes a direction parallel or vertical to an orientation flat OF. There, a wafer is supported by a wafer supporting stand in such a way that the orientation flat OF of the wafer becomes parallel, for example, to the horizontal scanning line direction of a TV camera 4, the defect density in this horizontal scanning line direction is metered, then the defect density in the vertical scanning line direction is metered in a state that the wafer is rotated in the right-angled direction. Moreover, the defect in the wafer can be detected by ready-giving a recognition processing program in such a way as to detect an image of a length of 2.0 mum or more and an aspect ratio of 1.6 or more or 0.6 or less.
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