| 摘要 |
PURPOSE:To increase the mounting density of parts by making it negligible for phenol resin, as a chip coating resin, to extend over a land for mounting chip type electronic parts, by a method wherein chip type electronic parts such as a chip type condenser and a chip type resistor are bonded, with conductive paste, to the electrode part of a circuit board together with a semiconductor chip. CONSTITUTION:A chip type condenser 6 and a chip type resistor 7 are bonded, together with a semiconductor chip 2, to the electrode part of a circuit board via conductive paste 3. The semiconductor chip 2, a bonding wire 4, the chip type condenser 6 and the chip type resistor 7 are all coated with phenol resin 5 for chip coating. Thereby, the spread of the resin 5 for chip coating can be neglected, and the mounting density of semiconductor chip, whereby chip type condenser and chip-type resistor can be increased.
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