| 摘要 |
PURPOSE:To prevent a land part from being covered with a resin which creeps to the rear by a method wherein a die bonding resin for a semiconductor pellet is coated onto a die bonding part and a through hole part and the through hole part is filled with the die bonding resin. CONSTITUTION:A semiconductor pellet 5 is die-bonded by using a resin 4 on a double-sided printed-circuit board whose surface and rear are connected electrically via through holes. The die bonding resin 4 for the semiconductor pellet 5 is coated onto die bonding parts 3 on the board 1 and onto through hole parts 2; the through hole parts 2 are filled with the die bonding resin 4. By this setup, when this assembly is sealed after a die bonding process of the semiconductor pellet, it is possible to prevent a silicone resin 6 from entering the through hole parts 2 and from creeping into a conductor pattern on the rear.
|
