| 摘要 |
PURPOSE:To enhance the moisture resistance characteristics, thermal stress characteristics and region bonding factor while preventing wires from shortcircuiting due to deformation thereof by a method wherein a conductor layer is coated with insulating films with holes made in the parts corresponding to electrode leading out parts of conductor layer. CONSTITUTION:Insulating films 25 are previously prepared as films with holes 26 made in the parts corresponding to electrode leading out parts of conductor wirings 234. Then, the coating of conductor wirings 234 is finished by coating the insulating substrates 234 with this insulating films 25 while making alignment of the electrode leading out parts with the holes 26 to be bonded using bonding agent etc. Later, wires 235 are connected to the electrode leading out parts through the holes 26. Besides, in order to make the holes 26 leading to the insulating films 25, e.g., etching process by chemical process, press machining process and a process using optical reaction can be used.
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