| 摘要 |
PURPOSE:To make electrical, ionic bonding good by etching the part, where is in contact with a solid electrolyte molding, of an electrode, and connecting the electrode with the solid electrolyte molding and a current collecting electrode. CONSTITUTION:The binder in the part, where is in contact with a solid electrolyte molding, a current collecting electrode, or both, of an electrode is removed with a solvent, or plasma etching treatment is applied to this part, then the electrode is connected with the solid electrolyte molding, the current collecting electrode, or both. Since the conductive material on the electrode molding is exposed without being completely covered with the binder, electrical, ionic bonding is kept good. |
