| 摘要 |
PURPOSE:To obtain the title coating material which enables the reduction in size and film thickness of a hybrid IC and which is excellent in reliability of moisture and heat shock resistances, by mixing two specified epoxy resins with a phenolic novolac resin, a cure accelerator and an organic solvent. CONSTITUTION:A coating material prepared by mixing an epi-bis epoxy resin (a) with a cresol novolac epoxy resin (b), a phenolic novolac resin (c), a cure accelerator (d) and an organic solvent (e). Said epi-bis epoxy resin is an epoxy resin derived from bisphenol A and epichlorohydrin, and it is preferable from the viewpoint of heat shock resistance, that it has an epoxy equivalent >=250. As said cresol novolac epoxy resin, an epoxy resin derived from a cresol novolac resin and epichlorohydrin is used. The amount of said epoxy resin (b) used is preferably 5-55wt.% based on the total epoxy resin.
|
