| 摘要 |
PURPOSE:To suppress the breakage of a function due to the penetrated moisture as much as possible by a method wherein a housing to accommodate an integrated circuit in its inside in a contactless manner is composed of an insulating material and the integrated circuit is plastic-sealed from the outside of the housing. CONSTITUTION:An integrated circuit 23 is mounted inside a housing 25 which is composed of an insulating material such as polyimide, polyimide glass or the like. Side walls 251 of this housing 25 are formed on an insulating substrate 231 along its external edges; a ceiling 252 is fixed on the side walls 251 by using an adhesive or the like. The integrated circuit 23 which has been accommodated in this housing 25 is sealed from the outside of the housing 25 by using a resin 24. By this setup, because it is possible to prevent the moisture penetrated into a package from reaching the integrated circuit 23, the dampproofness can be enhanced.
|
