发明名称 |
Polyamide resin from dimer/trimer acid and N-alkyl diamine |
摘要 |
Thermoplastic polyamide resins showing improved substrate adhesion and consisting essentially of polycondensates of the following components: (a) from 10 to 50 mole percent dimer fatty acids, having a trimer fatty acid content of from 10 to 20 mol percent; (b) from 25 to 45 mole percent of one or more aliphatic, aromatic and/or cyclic C2-C40 diamines which are diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms on the N-atom, or heterocyclic diamines capable of diamide formation, (c) from 5 to 25 mole percent of aliphatic diamines capable of diamide formation and N-alkyl-substituted on at least one N-atom, containing from 2 to 10 C-atoms and from 10 to 25 carbon atoms in the N-alkyl group, and (d) from 0 to 40 mole percent aliphatic C6-C22 dicarboxylic acids.
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申请公布号 |
US4777238(A) |
申请公布日期 |
1988.10.11 |
申请号 |
US19870033428 |
申请日期 |
1987.04.01 |
申请人 |
HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN |
发明人 |
LEONI, ROBERTO;GRUBER, WERNER;ROSSINI, ANGELA |
分类号 |
C08G69/00;C08G69/34;C09J177/00;C09J177/08;(IPC1-7):C08G69/34 |
主分类号 |
C08G69/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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