| 摘要 |
Several embodiments for mass airflow sensors are illustrated herein. In each case a sensing element (11) for the mass airflow sensor (10, 34, 50) is provided on a first portion (18) of a thin flexible film substrate (19) while an extension of this substrate provides integral electrical conductive metallizations (24) that connect the sensing element (11) to associated sensor electronic components (21) mounted on a second portion (23) of the film substrate remotely located from the first film portion. This eliminates the need for individual soldered wire connections to connect the sensing element to its associated electronics. In addition, housing portions (12, 13) for the sensor (10, 34, 50) mate together and provide protection for both the sensing element (11) and the sensor electronics (21) thereby providing an integral sensor module including the sensing element and its associated electronics. Preferably, the housing provides a cavity (29) remotely located from the sensing element so as to isolate the sensor electronics from the environment surrounding the sensing element. In addition, a self-powered and self-contained sensor (50) is provided which includes a power source (54) and visual display (56). Preferably, all assembly of sensor electronic components is accomplished by mounting techniques which mount these components to a planar flexible film substrate on which the sensing element is also deposited. Subsequently, the flexible substrate may have portions thereof bent out of the plane of other portions, and some portions of the flexible film substrate may be configured in nonplanar configurations.
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