Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating

摘要

A process of forming on a substrate a copper coating which has excellent mechanical properties, comprising depositing copper on the substrate by chemical plating, and forming at least one silver-rich layer during the deposition of copper, each silver-rich layer has a higher content of silver than the other portion of the copper coating. Also disclosed is a process of producing a printed-wiring board by forming such a copper coating.