| 摘要 |
A method for soldering surface mountable electronic components (40) to a printed circuit board (10) is described. The method involves the use of a wave soldering machine (22) to coat the pads (12) of the printed circuit board (10) with solder (26). After the pads (12) are coated with solder (26), the entire surface of the board (10) is covered with flux paste (38). Then, surface mountable electronic components (40) are positioned on the board (10). The viscous flux (38) coating holds the leads of each electronic component (40) to the pads (12) until the board (10) is placed in a furnace. The heat from the furnace first melts the flux (38) which chemically cleans the surface of the solder coated pads (12). Further increases in temperature melt the solder coating (44) to solder the component leads (42) to the pads (12). When the board (10) is subsequently removed from the furnace, the solder cools and resolidifies to electrically and mechanically connect the leads (42) to the pads (12). |
