| 摘要 |
<p>PURPOSE:To rearrange wafers in the order of thicknesses by measuring the thicknesses of conveyed wafers, sequentially taking out the wafers and containing them in the order of their thicknesses on the basis of the thickness data, and easily make the wafers correspond to the data. CONSTITUTION:The thickness of a wafer W conveyed from a wafer conveyor 1 is measured by a wafer thickness measuring machine 2, and the wafer W is then contained in a wafer stocker 3. Thereafter, a controller 8 operates the stocker 3 on the basis of the thicknesses of the wafers W, sequentially takes out the wafers W from the stocker 3 in the order of their thicknesses. If the thickness of the wafer taken out is not to specifications, the wafer is contained in a container 4 for wafers not to specifications. The wafers W after measurement are smoothly and accurately rearranged in the order of their thicknesses and respectively made to easily correspond to their thickness data.</p> |
