发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To reduce the production of defective device due to the adhesion of dust by providing a light transmitting member in a way that an electrode wire formed to an optical glass and an electrode pad of a solid-state image pickup element by a conductor member and an image pickup face is covered between the image pickup face of the solid-state image pickup element and the optical glass. CONSTITUTION:Electrode wires 25, 26 are formed to an optical glass 24 and the electrode wire 25 and the electrode pad 22 of the solid-state image pickup element 21 are connected via a pad 23 to cover the image pickup face of the solid-state image pickup element 21 by the transmitting member 27. After the image pickup face of the element 21 is covered by the transmitting member 27, adhesion of dust in air or sticked to components through the movement onto the image pickup face is prevented completely. Thus, the production rate of defective components due to adhesion of dust is remarkably reduced.
申请公布号 JPS63242072(A) 申请公布日期 1988.10.07
申请号 JP19870074146 申请日期 1987.03.30
申请人 TOSHIBA CORP 发明人 MATSUI KENICHI
分类号 H01L23/28;H01L27/14;H04N5/335;H04N5/367 主分类号 H01L23/28
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