| 摘要 |
PURPOSE:To provide copper wire having improved bonding properties and long-term reliability, by forming the copper wire of an alloy consisting of 0.1-1000 ppm of at least one of Na, K, Co, Ga, Rb, Sr, Y, Mo, Cs, Ba, W and Tl and 0.1-50 ppm of V, a summed amount of the two being 0.2-2000 ppm, and the balance of Cu. CONSTITUTION:Fine copper wire is formed of an alloy consisting of 0.1-1000 ppm of at least one of Na, K, Co, Ga, Rb, Sr, Y, Mo, Cs, Ba, W and Tl and 0.1-50 ppm of V, a summed amount of the two being 0.2-200 ppm, and the balance of Cu. Such alloy is casted in vacuum or in non-oxidizing atmosphere. Fine copper wire is manufactured by drawing and annealing the resultant ingot repeatedly, such that the final conversion rate is at least 70-99.99 % and extension by the final annealing is 2-20 %. |
